• Process Engineer Sustaining - Bond and Grind

    Job Locations US-NC-Durham
    Requisition ID
    Category (Portal Searching)
    LED Engineering
  • Job Description

    Job Summary

    Cree is looking to add a Process Sustaining Engineer to the Wafer Fab in our global headquarters located in Durham, NC.  In this role, you will be assisting in sustaining our 24/7 wafer fabrication manufacturing.  Specific opening would be in our bond and grind production area on 2nd shift (2pm-12am) including one weekend day. Standard work week would be Tuesday-Saturday.



    What can Cree do for you?

    • In this position, you will have the opportunity to utilize engineering and problem-solving skills to make significant contributions in the form of yield improvements, cost reductions, and throughput improvements.
    • Provide a unique opportunity to learn, interact, and integrate with all supporting groups like operations, equipment and process engineering, industrial engineering, and facilities.
    • You will have an opportunity to work with vendors and global engineers to have a real impact on Cree's future.



    What can you do for Cree?

    • Sustain and improve processes for LED device fabrication.
    • Interface with equipment engineering, management and manufacturing to improve cycle time, tool availability, process/product yield, and drive cost reductions.
    • Partner with product engineering and R&D to ensure effective new product and process introductions as well as consistent device performance and quality.            
    • Create and maintain operating specifications for production processes and equipment.
    • Drive innovation and continuous improvement in a fast-paced, dynamic environment.



    What you need for success:

    • BS in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, or Equivalent.
    • Working knowledge of semiconductor processes.
    • Willingness to work a flexible schedule in support of 24x7 manufacturing including second shift.
    • Strong interpersonal and communication skills.



    Highly preferred skills and certifications:

    • 1-3 years of Wafer Fab Engineering Experience, ideally with compound semiconductors.
    • Semiconductor processing experience in wafer bonding and thinning.
    • Technical understanding of semiconductor processes and equipment.
    • Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions.
    • Consistent history of continuous process improvement.
    • Ability to work with minimal supervision.
    • Ability and desire to assume a technical leadership role within the organization.
    • Working knowledge of applied statistics (SPC/DOE).


    Since our beginning 30 years ago, we have introduced innovative and disruptive solutions that enable a more efficient, productive and safer world. We continue our leadership in developing market-leading lighting-class LEDs, lighting products and semiconductor products for power and radio frequency (RF) applications. We believe in unlocking the power and potential of technology, enabling the world to do more with less. We aim to transform the way people experience light and are also leading the innovation of Power/RF products that move us toward a more energy efficient future.

    Be part of our future and have a direct impact while working for an organization that provides a place to work alongside brilliant people, a competitive total rewards package, and a problem solving culture. We invite you to submit an application if you feel we would be a good fit.

    We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.



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